• #0 (no title)
  • #0 (no title)
  • About
  • Facebook
  • Twitter
  • RSS
(As ISO 9001:2015 Certified Publications)
    • Quick Search
    • Advanced Search
  • Home
  • Editorial Policy
  • Author Guidelines
  • Submission
  • Copyright Form
  • Career
  • Contact us
  • Subscription

Back to Journal

Home»Articles»Fabrication and Analysis of Thermal Insulation Boards from Rice Husk

JournalCover

Asian Journal of Engineering and Applied Technology (AJEAT)

Editor Dr. Seshadri Ramkumar
Print ISSN : 2249-068X
Frequency : Quarterly

Fabrication and Analysis of Thermal Insulation Boards from Rice Husk

Author : Deepak Dhand
Volume 7 No.2 Special Issue:November 2018 pp 26-29

Abstract

There is an increased awareness to preserve the environment in the present day society. Rice Husk (RH),is the widely available agricultural wastes and is a serious concern for the environment. It is a potential material for use as alternative material in the construction and insulation industry. The particle board made from rice husk (RH) or rice husk ash (RHA), bonded by resin under the application of pressure and temperature. Urea formaldehyde is the organic resin used in general for interior use whereas phenol formaldehyde for external disclosure. The said resins are preferred for their water-resistant properties and better binding strength. The present study investigates the potential of rice husk reinforced boards by experimenting the different compositions and thicknesses. The objective is to perform a thermal analysis of the processed Rice husk boards. Boards made from rice husk are biodegradable unlike glass wool & other synthetic insulations. After experimenting on different fabrication conditions, six samples were finalized and were tested for physical and thermal viability in their applications. This study found that by adding ash of rice husk, the density of board decreases with respect to the board of same weight and consisting of rice husk only. Moisture Content is higher in case of boards with RHA but is within permissible limits. RHA reinforced boards have improved thermal properties, which is desirable in case of insulation boards.

Keywords

Rice husk, Rice husk ash, Active silica, Preparation, Characterization, Thermal analysis

Full Text:

References

[1] C. Real, M.D. Alcala and J.M. Criado, “Preparation of silica fromrice husks,”Journal of the American Ceramic Society, Vol. 79, pp. 2012-2016, 1996.
[2] R. Conradt, P. Pimkhaokham and U. Leela-Adisorn, “Nano structured silica from rice husk,”Journal of Non-Crystalline Solids, Vol. 145, pp. 75-79,1992.
[3] J.M. Chenand F.W. Chang, “The chlorination kinetics of rice husk,”Indian Engineering Chemical Research ,Vol. 30, pp. 2241-2247, 1991.
[4] T.B. Ghosh, K.C. Nandi, H.N. Acharyaand D. Mukherjee, “X-rayphotoelectron spectroscopic analysis of amorphous silica Ð Acomparative study,”Materials Letters,Vol. 12, 175-178, 1991.
[5] K.C. Nandi, A.K. Biswas andH.N. Acharya, “Density-of-statesdetermination in hydrogenated amorphous silicon obtained fromrice husk,”Materials Letters,Vol. 12, pp.171-174, 1991.
[6] B.B. Nayak, B.C. Mohanty andS.K. Singh, “Synthesis of silicon carbide from rice husk in a dc arc plasma reactor,”Journal of theAmerican Ceramic Society, Vol. 79,1197±2000, 1996.
[7] T.B. Ghosh, K.C. Nandi, H.N. Acharya andD. Mukherjee, “XPSstudies of magnesium silicide obtained from rice husk,”MaterialsLetters ,Vol. 11, pp. 6±9, 1991.
[8] S. Bose, H.N. Acharya andH.D. Banerjee, “Electrical, thermal, thermoelectric and related properties of magnesium silicide semiconductor prepared from rice husk,”Journal of Materials Science,Vol. 28,pp. 5461±5468, 1993.
[9] A.Kumar, K. Mohanta, D. Kumar andO.Prakash, “Properties and Industrial Applications of Rice husk: A review,”International Journal of Emerging Technology and Advanced Engineering,Vol. 2, No. 10,pp. 86-90, 2012.
[10] G. Giaccio, G. R. de Sensaleand and R. Zerbino, “Failure mechanism of normal and high strength concrete with rice-huskash”, Cement and Concrete Composites,Vol. 29, pp. 566-574, 2007.
[11] S. K. Bhatnagar, “Fire and Rice Husk Particleboard”, Fire andMaterials,Vol. 18, pp. 51-55, 1994.
[12] Fire Tests on Building Materialsand Structures, Part 5. IgnitabilityTest for Materials, BS 476:Part 5: 1968, British StandardsInstitution, London, 1968.
[13] P. Leiva, E. Ciannamea, R. A.Ruseckaite and P. M. Stefani,“Medium-Density Particleboardsfrom Rice Husks and SoybeanProtein Concentrate”, Journal of Applied Polymer Science, Vol. 106, pp.1301–1306, 2007.

Asian Journal of Engineering and Applied Technology is a peer-reviewed International research journal aiming at promoting and publishing original high quality research in all disciplines of engineering and applied technology. All research articles submitted to AJEAT should be original in nature, never previously published in any journal or presented in a conference or undergoing such process across the world. All the submissions will be peer-reviewed by the panel of experts associated with particular field. Submitted papers should meet the internationally accepted criteria and manuscripts should follow the style of the journal for the purpose of both reviewing and editing.

AJEAT is covering all aspects of Engineering and Applied Technology areas. Topics include, but are not limited to:

Aerospace engineering
Agricultural engineering
Architectural engineering
Bioengineering and biomedical engineering
Chemical engineering
Civil engineering
Computer engineering
Computer science and information science
Electrical engineering and electronics engineering
Environmental engineering

Industrial engineering
Metallurgical engineering
Ceramic engineering
Materials science
Metallurgy
Mechanical engineering
Nuclear engineering
Petroleum engineering
Plastics engineering and polymer science
Textile & Fashion Technology

There is an increased awareness to preserve the environment in the present day society. Rice Husk (RH),is the widely available agricultural wastes and is a serious concern for the environment. It is a potential material for use as alternative material in the construction and insulation industry. The particle board made from rice husk (RH) or rice husk ash (RHA), bonded by resin under the application of pressure and temperature. Urea formaldehyde is the organic resin used in general for interior use whereas phenol formaldehyde for external disclosure. The said resins are preferred for their water-resistant properties and better binding strength. The present study investigates the potential of rice husk reinforced boards by experimenting the different compositions and thicknesses. The objective is to perform a thermal analysis of the processed Rice husk boards. Boards made from rice husk are biodegradable unlike glass wool & other synthetic insulations. After experimenting on different fabrication conditions, six samples were finalized and were tested for physical and thermal viability in their applications. This study found that by adding ash of rice husk, the density of board decreases with respect to the board of same weight and consisting of rice husk only. Moisture Content is higher in case of boards with RHA but is within permissible limits. RHA reinforced boards have improved thermal properties, which is desirable in case of insulation boards.

Editor-in-Chief
Dr. Seshadri Ramkumar
Department of Environmental Toxicology, Texas Tech University, Texas
[email protected]
Editorial Advisory Board
Dr. Kamarul Ariffin Bin Noordin
Department of Electrical Engineering, University of Malaya, Malaysia
[email protected]
Dr. Benjamin T.F. Chung
Department of Mechanical Engineering, University of Akron, Akron, USA
[email protected]
Dr. Mohd Faiz Bin Mohd Salleh
Department of Electrical Engineering, University of Malaya, Malaysia
[email protected]
Dr. Suhana Binti Mohd Said
Department of Electrical Engineering, University of Malaya, Malaysia
[email protected]
Dr. Norrima Binti Mokhtar
Department of Electrical Engineering, University of Malaya, Malaysia
[email protected]
Dr. Mohamadariff
Department of Electrical Engineering, University of Malaya, Malaysia
[email protected]

2016

2015

2014

  • Results
  • Asian Review of Mechanical Engineering (ARME)
  • career

2013

  • Home
  • Shop
  • My Account
  • Logout
  • Contact us
  • The Asian Review of Civil Engineering (TARCE)

2012

  • Asian Journal of Electrical Sciences(AJES)
  • Asian Journal of Computer Science and Technology (AJCST)
  • Asian Journal of Information Science and Technology (AJIST)
  • Asian Journal of Engineering and Applied Technology (AJEAT)
  • Asian Journal of Science and Applied Technology (AJSAT)
  • Asian Journal of Managerial Science (AJMS)
  • Asian Review of Social Sciences (ARSS)

2011

2010

    Table of Contents

    Editorial Note

    Editorial Dr. Seshadri Ramkumar

    Editor-in-Chief
    Dr. Seshadri Ramkumar
    Department of Environmental Toxicology, Texas Tech University, Texas
    [email protected]
    Editorial Advisory Board
    Dr. Kamarul Ariffin Bin Noordin
    Department of Electrical Engineering, University of Malaya, Malaysia
    [email protected]
    Dr. Benjamin T.F. Chung
    Department of Mechanical Engineering, University of Akron, Akron, USA
    [email protected]
    Dr. Mohd Faiz Bin Mohd Salleh
    Department of Electrical Engineering, University of Malaya, Malaysia
    [email protected]
    Dr. Suhana Binti Mohd Said
    Department of Electrical Engineering, University of Malaya, Malaysia
    [email protected]
    Dr. Norrima Binti Mokhtar
    Department of Electrical Engineering, University of Malaya, Malaysia
    [email protected]
    Dr. Mohamadariff
    Department of Electrical Engineering, University of Malaya, Malaysia
    [email protected]

    Articles

Advanced Search

You can submit your research paper to the journal in just a few clicks. Please follow the steps outlined below: 1. Register your details and select to be an Author 2. Log in with your user name and password 3. ‘Start a new submission’ and follow these 5 steps:

[gravityform id="1" name="Registration" title="false" description="false"]

Privacy Statement

The names and email addresses entered in this journal site will be used exclusively for the stated purposes of this journal and will not be made available for any other purpose or to any other party.

Privacy Statement

The names and email addresses entered in this journal site will be used exclusively for the stated purposes of this journal and will not be made available for any other purpose or to any other party.

Lorem1 ipsum dolor sit amet, consectetur adipiscing elit. Nulla convallis ultricies scelerisque. Fusce dolor augue, sollicitudin eget lacus vitae, rutrum commodo lacus. Praesent ullamcorper facilisis dui. Sed suscipit id lorem ut dapibus. Integer dictum cursus nisl, quis ullamcorper augue. Sed non rutrum mauris. Maecenas in dolor est. Donec eget sagittis mi. Sed non leo eu odio mollis pulvinar vitae et leo. Integer eu feugiat tortor. Duis massa purus, eleifend id erat eget, hendrerit semper risus. Suspendisse cursus varius dapibus

Lorem1 ipsum dolor sit amet, consectetur adipiscing elit. Nulla convallis ultricies scelerisque. Fusce dolor augue, sollicitudin eget lacus vitae, rutrum commodo lacus. Praesent ullamcorper facilisis dui. Sed suscipit id lorem ut dapibus. Integer dictum cursus nisl, quis ullamcorper augue.

Subscription

Subscription (for 12 issues):
Rs. 5000; Overseas - USD 500;
Cheque drawn in favour of "Informatics Publishing Limited"
Click here to download online subscription form

Download

DD Mailing Address

Lorem1 ipsum dolor sit amet,
Lorem1 ipsum dolor sit amet,
Lorem1 ipsum dolor sit amet.

BACK TO TOP

Outstanding Scholars

The Journals honor Outstanding Scholars in various fields. Scholar of the Month should have contributed to their field and to the larger community. Recipients will be nominated by the Advisory Board and approved by the Editor-in-Chief of the allied journals published by The Research Publication. Scholar of the Month will be displayed in the web portal of the concerned journal.

Please send your brief write up to [email protected]

Editors and Reviewers

The Research Publication is seeking qualified researchers to join its editorial team as Associate Editor, Editorial Advisory Board Member, and Reviewers.
Kindly send your details to [email protected]

Call For Papers

Authors are requested to submit their papers electronically to [email protected] with mentioning the journal title.

Mailing Address

The Research Publication 1/611, Maruthi Nagar, Rakkipalayam Post, Coimbatore – 641 031, Tamil Nadu, India Phone No.: 0422 2461001

  • About
  • Editorial Policy
  • Author Guidelines
  • Contact us
  • Copyright
  • Facebook
  • Twitter
  • RSS

© 2015 The Research Publication. All rights reserved.

The Research Publication
  • Home
  • Editorial Policy
  • Author Guidelines
  • Submission
  • Copyright Form
  • Career
  • Contact us
  • Subscription