Asian Journal of Engineering and Applied Technology (AJEAT)
Prediction of Effective Thermal Conductivity of Cu/Solder System by Using Interfacial Layer in Two Phase System
Author : Jyoti Rani, K. J. Singh and Ramvir SinghVolume 3 No.2 July-December 2014 pp 16-18
Abstract
A theoretical model is presented to predict effective thermal conductivity of real two phase materials from the values of thermal conductivity of the constituent phases and their volume fraction. Here we develop a numerical expression for effective thermal conductivity of Cu-solder system in two phase system is being comprised of contributions from both the phases with interfacial layer. A new correlation term F is introduced for highly conducting phase, non-linear fl ow of heat fl ux lines and random distribution of the phases. Here, we get best fi tting relation for F. Comparison of the proposed relation with different models has also been made. The values predicted by the proposed model are in close and good agreement with experimental values and more accurate than those obtained from existing models.
Keywords
Effective thermal conductivity (ETC), real two phase system, correction term, interfacial layer, resistor model, metal
foam.
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